Guangzhou Sanjing Intelligent introduces Sinic-Tek online High-Speed 3D Solder Paste Inspection (SPI) system!

   SPI is mainly to check the solder paste deposits in the Printed Circuit Board (PCB) manufacturing process. It is observed that most of the solder joint defects in a printed circuit board assembly (PCBA) are because of improper soldering paste printing. With the help of SPI, SMT manufacturer can reduce the defects related to soldering by a considerable amount.

Sanjing Intelligent, Quality Assurance!